Application of a Ternary Zn-Based Solder Alloy for Joining of AZ31B Magnesium Alloy with Ultrasonic Support

Abstract:

Contribution deals with soldering of Mg alloy AZ31B by ternary solder ZnAl6Ag6 with ultrasonic support. Suggested solder has been analyzed from many aspects. Microstructure of solder consistutes of solid solution α-Al (FCC_Al), β-Zn (HCP_Zn) and intermetallic phases AgZn₃ and AlAg₃. Melting temperature of solder 386.8 °C has been determined by DSC analysis. Metallurgical process of ultrasonic soldering has run at 410 °C for 3 s. Soldered joint has been constituted by eutectic ternary structure β-Mg₁₇(ZnAl)₁₂, solid solution α - Mg, which contains Al and Ag elements. At solder-substrate interface, there has been formed intermetallic phase Mg₂Zn₁₁. The highest value of microhardness has been 260 HV. To predict lifetime of soldered joint, calculations in software Thermo-Calc has been performed.

• Periodical: Advanced Materials Research (Volume 1077)
• Pages: 82-88
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1077.82
• Online since: December 2014
• Authors: Miroslav Jáňa*, Milan Turňa, Milan Marônek, Marcel Kuruc, Pavel Bílek
• Keywords: Intermetallic Phase, Metallurgical Joining, Mg Alloy, Solder

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