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The Influence of CTAB Surfactant on the Dispersion of Al2O3 Particles and Deposition Rate of Electroless Ni-P-Al2O3 Coatings

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Abstract:

In this paper, electroless Ni-P-Al2O3 coatings have been synthesized on mild steel shaft by adding various concentration of cetyltrimethyle ammonium bromide (CTAB) into plating baths. Compared with Polyvinyl pyrrolidone (PVPk30), cationic surfactant CTAB shows better effect in dispersing the Al2O3 particles. With the increasing of CTAB concentration in the plating baths, dispersion of Al2O3 particles in the Ni-P-Al2O3 coatings was improved due to high electrostatic repulsive force between Al2O3 particles and CTAB molecular, whereas deposition rate of the Ni-P-Al2O3 coatings was decreased.

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Periodical:

Advanced Materials Research (Volume 1095)

Pages:

641-646

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1095.641

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Online since:

March 2015

Authors:

Da Yong Liu*, Jie Yu

Keywords:

CTAB, Deposition Rate, Dispersion, Electroless Plating, Ni-P-Al2O3 Coating

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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