Simulation on the Temperature Field of Milling Roller Using Fluent Software

Min Wang; Ke Ping Zhang; Feng Wei Zhang

doi:10.4028/www.scientific.net/AMR.1095.846

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1095Simulation on the Temperature Field of Milling...

Simulation on the Temperature Field of Milling Roller Using Fluent Software

Abstract:

In order to study the law between the internal coolant flow rate and the temperature of milling roller, the temperature field of water-cooled roller was simulated with Fluent software. The results showed that with the increase of the coolant flow rate, the temperature on roller surface decreased, but after the flow rate of coolant increased to 3.5 kg/s, the temperature of roller maintained invariant almost, so 3.5 kg/s was the best flow rate.

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Periodical:

Advanced Materials Research (Volume 1095)

Pages:

846-850

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1095.846

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Online since:

March 2015

Authors:

Min Wang, Ke Ping Zhang*, Feng Wei Zhang

Keywords:

Fluent, Milling Roller, Surface Temperature, Temperature Field

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* - Corresponding Author

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