Thermophysical Properties in Assembling Process at Macro and Micro Level

Abstract:

The electronic modules are complex ensemble of electronic components having terminals (PIN) connected by solder joints on dedicated metallic surfaces (PAD) parts of conductive interconnection structure realized on rigid or flexible dielectric substrate having different core materials. The reliability of the electronic modules could be considered as expression of solder joints functionality (SJF) relating to working conditions and unique defined by their electrical, mechanical and thermal properties. These properties are in close connection with the solder joints microstructures, result of the soldering Process temperature gradient action over the trinomial solder alloy Paste, Pin and Pad. Consequently the solder joints quality can be correctly evaluated taking into consideration not only the severally intrinsic parameters of the trinomial elements Pin-Pad-Paste characterized by specific thermophysical properties (ThP), but also interrelate the complex reaction at the interface between them and interdependence with the soldering Process parameters.In the paper, will be analyzed the influencing factors of manufacturing processes, the most important assembling defects at macro and micro level, their causes relating to specific ThP and processes at interfaces Pin-solder joints-Pad, it will be identify the Key Process Input Variables (KPIV) and propose a structural model for assembling processes, 4P Soldering Model, as an useful tool in engineering of electronic product in order to assure the assumed goal for assembling stage.

• Periodical: Advanced Materials Research (Volume 1114)
• Pages: 172-179
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1114.172
• Online since: July 2015
• Authors: Mihai Branzei, Ioan Plotog*
• Keywords: Assembling Process, Reflow, Solder Joints, Surface Mounted Technology, Thermal Diffusivity

References

[1] I. Plotog, A. Marin, L. Boanta, Model of assembling process for electronic parts integrated in mechatronic products, The Romanian Review Precision Mechanics, Optics & Mechatronics, 2013, No. 44, pg. 12-19, ISSN 1584 – 5982.

[2] R. Strauss, SMT Soldering Handbook, Butterworth-Heinemann Linacre House, pp.179-189, Oxford, 1998, ISBN 0 7506 35894.

[3] I. Plotog, M. Vladescu, Working temperatures influence over the solder joints properties, The 37th International Spring Seminar on Electronics Technology, ISSE 2014, 7-11 May 2014, Dresden, Germany, Pg. 231 – 236, DOI: 10. 1109/ISSE. 2014. 6887599.

DOI: 10.1109/isse.2014.6887599

[4] I. Plotog, G. Varzaru, P. Svasta, Mechanical test assessment for electronic modules able to function in harsh conditions, 3rd International Symposium on Electrical and Electronics Engineering, ISEEE 2010, 16-18 September 2010, Galati Romania, Print ISBN: 978-1-4244-8406-5, INSPEC Accession Number: 11651306, p.355.

DOI: 10.1109/iseee.2010.5628466

[5] O. Krammer, T. Garami, Reliability Investigation of SACX Micro-Alloyed, Low Silver Content Solders, 35th International Spring Seminar on Electronics Technology - Power Electronics, – ISSE2012, Bad Aussee, Austria, 09-13 May (2012).

DOI: 10.1109/isse.2012.6273126

[6] O. Krammer, Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering, Soldering & Surface Mount Technology, Vol. 26 Iss 4 p.214.

DOI: 10.1108/ssmt-09-2013-0023

[7] A. Geczy, P. Szoke, Z. Illyefalvi-Vitez, M. Ruszinko, R. Bunea, Soldering profile optimization for vapour phase reflow technology, IEEE1-17th International Symposium for Design and Technology in Electronic Packaging SIITME 2011, 20-23 October, Timisoara, Romania.

DOI: 10.1109/siitme.2011.6102707

[8] A. Pietrikova, L. Livovsky, J. Urbancik, R. Bucko, Optimization of Lead Free Solders Reflow Profile, in IEEE 29th International Spring Seminar on Electronics Technology, ISSE 2006, St. Marienthal, Germany, 2006, pp.459-464.

DOI: 10.1109/isse.2006.365149

[9] P. Svasta, I. Plotog, Vapour Phase Soldering Applications for PCB Assembling, PLUS - Produktion von Leiterplatten Und Systemen, August 2010, pp.1861-1870, ISSN 1436-7505, B 49475.

[10] M. Branzei, P. Svasta, F. Miculescu, M. Miculescu, I. Plotog, Correlation Between the Thermo-physical Properties, Geometry and Microstructure of the SAC305 and SAC-X Typical Solder Joints, 17-20 Sep 2009, Gyula, Hungary, Conference proceedings, pp.129-133.

DOI: 10.1109/siitme.2009.5407386

[11] Svasta P., Plotog I., Cucu T., Vasile A., Marin A., 4 P Soldering Model for Solder Joints Quality Assessment, ISSE 2009, The 32nd International Spring Seminar on Electronics Technology, 13-17 May, Brno, Czech Republic proceedings ISBN 978-80-214-3874-3.

DOI: 10.1109/isse.2009.5206936