[1]
E. N. Brown, M. R. Kessler, N. R. Sottos and S. R. White, In situ poly(urea-formaldyhyde) microencapsulation of dicyclopentadine, Journal of Microencapsulation, Nov-Dec, 2003(20): pp.719-730.
DOI: 10.1080/0265204031000154160
Google Scholar
[2]
E. N. Brown, S. R. White, N. R. Sottos. Fracture testing of a self-healing polymer composite. Exp Mech 42(4): p.372–379. (2002).
DOI: 10.1007/bf02412141
Google Scholar
[3]
E. N. Brown. Fracture and fatigue of a self-healing polymer composite material. PhD thesis, Department of Theoretical and Applied Mechanics, University of Illinois Urbana-Champaign. (2003).
Google Scholar
[4]
E. N. Brown, S. R. White, N.R. Sottos, Retardation and repair of fatigue cracks in a microcapsule toughened epoxy composite. Part 2: in-situ healing. Compos Sci Technol 65(15-16): 2474–2480. (2005).
DOI: 10.1016/j.compscitech.2005.04.053
Google Scholar
[5]
E. N. Brown, S. R. White, N. R. Sottos, Fatigue crack propagation in microcapsule toughened epoxy. J Mat Sci (in press) (2006).
DOI: 10.1007/s10853-006-0512-y
Google Scholar
[6]
E. N. Brown, S. R. White, N. R. Sottos. Microcapsule induced toughening in a self-healing polymer composite. J Mat Sci 39: p.1703–1710. (2004).
DOI: 10.1023/b:jmsc.0000016173.73733.dc
Google Scholar
[7]
H. Jin, G. M. Miller, S. J. Pety, A. S. Griffin, D. S. Stradley, D. Roach, N. R. Sottos, S. R. White, Fracture behavior of a self-healing, toughened epoxy adhesive, International Journal of Adhesion and Adhesives, 44. 2013. pp.157-165.
DOI: 10.1016/j.ijadhadh.2013.02.015
Google Scholar
[8]
B.J. Blaiszik, N. R. Sottos, S. R. White. Nanocapsules for self-healing materials. Composites Science and Technology 68. p.978–986 (2008).
DOI: 10.1016/j.compscitech.2007.07.021
Google Scholar
[9]
A. A. Rzeszutko, E. N. Brown, N. R. Sottos, Tensile Properties of Self-Healing Epoxy. (2006).
Google Scholar
[10]
M.W. Keller, N.R. Sottos, Effect of microcapsule properties on self-healing composite performance. In: Proceedings of the 2004 SEM X International Congress on Experimental and Applied Mechanics. (2004).
Google Scholar
[11]
Q. Li, A. K. Mishra, N. H. Kim, T. Kuila, K.T. Lau, J.H. Lee, Effects of processing conditions of poly(methylmethacrylate) encapsulated liquid curing agent on the properties of self-healing composites. Composites: Part B 49. p.6–15, (2013).
DOI: 10.1016/j.compositesb.2013.01.011
Google Scholar
[12]
Q. Li, Siddaramaiah., N. H. Kim, D. Hui, J.H. Lee. Effects of dual component microcapsules of resin and curing agent on the self-healing efficiency of epoxy. Composites: Part B 55 79–85, (2013).
DOI: 10.1016/j.compositesb.2013.06.006
Google Scholar