Electrochemical Migration Characteristics of Ag-Plated Cu Powders in Conductive Thick Film

Yuan Long Liu; Jin Ming Long; Xiao Yun Zhu; Wen Jing Liu

doi:10.4028/www.scientific.net/AMR.146-147.1070

Paper Titles

The Structure and Acoustic Properties of Aluminum Foams by Gas Injection Method
p.1049

Microstructure Simulation of Aluminium Alloy Wheel Die Forging Using Cellular Automaton
p.1056

Stability and Antioxidant Activity of Polyphenols in Methanolic Extracts of Sonneratia caseolaris Seeds
p.1062

Study on the Crystalline Morphology of Calcium Sulfate in H₃PO₄ and HNO₃ Aqueous Medium
p.1066

Electrochemical Migration Characteristics of Ag-Plated Cu Powders in Conductive Thick Film
p.1070

The Research on Smart Drill-In Fluid Design
p.1075

Microstructures and Mechanical Properties of the Mg-xGd-Er (x=5, 7, 9 and 11wt%) Alloys
p.1080

Using CFRP to Repair the Steel Pipe with Fatigue Cracks
p.1086

Dynamic Visco-Elastic Properties of Polycarbonate (PC) under Static and Dynamic Load
p.1090

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 146-147Electrochemical Migration Characteristics of...

Electrochemical Migration Characteristics of Ag-Plated Cu Powders in Conductive Thick Film

Abstract:

Silver electrochemical migration results in the degradation of surface insulation resistance, and has been attributed to the dendritic bridge between adjacent conductors. In this paper, the electrochemical migration behavior of both Ag-plated Cu powder and pure silver powder in conductive thick film (CTF) are investigated. By Electrochemical migration test (water drop+ DC bias method), and the SEM and XRD examinations, it was found that the silver electrochemical migration in CTF was minimized when the Ag-plated Cu powder substitute silver powder in CTF. This is ascribed to the galvanic coupling effect that plays an important role in the migration inhibition. As sacrifice anode copper restrains the cathodic silver from dissolving in solution so as to decreases the probability of dendritic growth.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 146-147)

Pages:

1070-1074

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.146-147.1070

Citation:

Cite this paper

Online since:

October 2010

Authors:

Yuan Long Liu, Jin Ming Long, Xiao Yun Zhu, Wen Jing Liu

Keywords:

Ag-Plated Cu, Conductive Thick Film, Electrochemical Migration, Galvanic Corrosion

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] S. Yang, J. Wu and A. Christou: Microelectronics Reliability Vol. 46 (2006), p. (1915).

Google Scholar

[2] X.G. Cao, B.L. Wu: Materials for Mechanical Engineering Vol. 29 (2005), p.31 (In Chinese).

Google Scholar

[3] L.Y. Zhong, B.L. Wu and L.Y. He: Paint and Coatings Industry Vol. 33 (2003), p.12 (In Chinese).

Google Scholar

[4] G.Y. Charles, K.N. Han: Journal of the Electrochemical Society Vol. 142 (1995), p.1819.

Google Scholar

[5] H. Zhu, F.X. Gan: Journal of Chinese Society for Corrosion and Protection Vol. 25 (2005), p.245 (In Chinese).

Google Scholar

[6] J.Y. Jung, S.B. Lee, Y.C. Joo, H.Y. Lee and Y.B. Park: Microelectronic Engineering Vol. 34 (2008), p.1597.

Google Scholar

[7] G. Harsányi: IEEE Transactions on Components, Packaging, and Manufacturing Technology – Part A Vol. 18 (1995), p.602.

Google Scholar

[8] J.C. Lin, J.Y. Chan: Materials Chemistry and Physics Vol. 43 (1996), p.256.

Google Scholar

[9] T. Takemoto, R.M. Latanision, T.W. Eagar and A. Matsunawa: Corrosion Science Vol. 39 (1997), p.1415.

DOI: 10.1016/s0010-938x(97)00038-3

Google Scholar

[10] G.T. Kohman, H.W. Hermance and Downes: The Bell System Technical Journal Vol. 34 (1995), p.1115.

Google Scholar

[11] C. Dominkovics, G. Harsányi: Microelectronics Reliability Vol. 48 (2008), p.1628.

Google Scholar

[12] J.J. Steppan, J.A. Roth, L.C. Hall, D.A. Jeannotte and S.P. Carbone: Journal of the Electrochemical Society: Solid-State Science and Technology, Vol. 134 (1987), p.175.

Google Scholar