Study on Dynamic Recrystallization Behavior of Cu-Ni-Si Alloy

Abstract:

Article Preview

The flow stress behavior of Cu-2.0Ni-0.5Si alloy during hot compression deformation was studied by isothermal compression test at Gleeble-1500D thermal-mechanical simulator.Dynamic recrystallization and dynamic recovery during high temperature deformation have been investigated by means of compression tests in the temperature and strain rate ranges of 873 to 1073 K and 0.01 to 5s-1 under maxium strain of 60%. The results show the flow stress was controlled by both strain rate and deforming temperature,the flow stress decreases with the increase of deforming temperature,while increases with the increase of strain rate.The hot deformation equation is e& = e28.47[sinh(0.013s )]5.52 exp(-245.4´103 / RT ) .

Info:

Periodical:

Advanced Materials Research (Volumes 146-147)

Edited by:

Sihai Jiao, Zhengyi Jiang and Jinglong Bu

Pages:

701-704

DOI:

10.4028/www.scientific.net/AMR.146-147.701

Citation:

Y. Zhang et al., "Study on Dynamic Recrystallization Behavior of Cu-Ni-Si Alloy", Advanced Materials Research, Vols. 146-147, pp. 701-704, 2011

Online since:

October 2010

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.