Microstructure Evolution of Directionally Solidified Al-Cu Alloys

Min Qu; Lin Liu; Ming Zhao; Feng Bin Liu; Guang Ping He

doi:10.4028/www.scientific.net/AMR.146-147.729

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 146-147Microstructure Evolution of Directionally...

Microstructure Evolution of Directionally Solidified Al-Cu Alloys

Abstract:

The microstructure evolution of Al-Cu alloys with different compositions is investigated in directional solidification. Two distinctly different microstructure evolution mechanisms are obtained in Al-0.85%Cu and Al-4%Cu systems, respectively. In Al-0.85%Cu alloy, it shows a peculiar phenomenon, the microstructure evolution is always cells and no dendrites are obtained. In other words, the cells undergo several transitions as the pulling velocity increasing from 15μm/s to 300μm/s, they follow the sequences: mixed microstructure of pox and banded cells →mixed microstructure of polygonal and banded cells →banded cells →elongated cells. Particularly, it is studied what caused the dendrites not appear in Al-0.85%Cu system. Finally, it comes to the conclusion that there are two aspects which lead to the phenomenon: a dilute alloy composition and a relatively higher temperature gradient.

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Advanced Materials Research (Volumes 146-147)

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729-733

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https://doi.org/10.4028/www.scientific.net/AMR.146-147.729

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October 2010

Authors:

Min Qu, Lin Liu, Ming Zhao, Feng Bin Liu, Guang Ping He

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Al-Cu Alloys, Cells, Directional Solidification, Microstructure

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