Effect of Metal Particles on Spreading Properties of Sn0.7Cu Based Composite Solder

Li Yang; Na Zhang

doi:10.4028/www.scientific.net/AMR.152-153.1759

Paper Titles

A Novel Scaffold from Recombinant Spider Silk Protein in Tissue Engineering
p.1734

Semi-Solid A356 Alloy Slurry Prepared by Slightly Electromagnetic Stirring with Ti-Based Refiner
p.1745

Study on the Plasma Beam Surface Remelting Modification of Nodular Cast Iron
p.1751

In Situ TEM Observation of Phase Transformation for Bio-Medical Shape Memory TiNbSn Alloy
p.1755

Effect of Metal Particles on Spreading Properties of Sn0.7Cu Based Composite Solder
p.1759

Bioactive Calcium Phosphate Coating on Carbon/Carbon Composites Prepared by Ultrasonicated Induction Heating Deposition
p.1763

Compatibility of L-Tyrosine Derived Biodegradable Polycarbonate/Chitosan Blends
p.1767

Preparation of Novel Ag/Bacterial Cellulose Hybrid Nanofibers for Antimicrobial Wound Dressing
p.1771

Synthesis and Cure Kinetic Studies of a New Trifunctional Imide Oligomer
p.1775

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 152-153Effect of Metal Particles on Spreading Properties...

Effect of Metal Particles on Spreading Properties of Sn0.7Cu Based Composite Solder

Abstract:

The particle-reinforced composite solder is prepared by adding 1 μm Ag, 1 μm Ni and 8 μm Cu into Sn0.7Cu eutectic solder which serve as the base material in current research. The formation of a thin layer of intermetallics around the particle-reinforced will promote the closer integration between base-solder and particle-reinforced, and thus form the particle-reinforced composite solder. The appropriate reinforcement particles were selected and the effects of reinforcement particles on physical properties, mechanical properties and solderability of the composite solder were studied. The spreading property of Ni (3 vol %) particle-reinforced Sn0.7Cu based composite solder was the worst among Sn0.7Cu based composite solders. The spreading property of the Cu particle-reinforced Sn0.7Cu based composite solder was worse than those of Ag particle-reinforced Sn0.7Cu based composite solders. So the conclusion is drawn that Ag particles are considered as the most appropriate reinforced particles for Sn0.7Cu based composite solders.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 152-153)

Pages:

1759-1762

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.152-153.1759

Citation:

Cite this paper

Online since:

October 2010

Authors:

Li Yang, Na Zhang

Keywords:

Composite Solder, Particle-Reinforced, Sn0.7Cu, Spreading Property

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] S. Dhabal and T.B. Ghosh: Applied Surface Science. 2003, 211(1): 13-23.

Google Scholar

[2] N. Tamura, R. Ohshita, M. Fujimoto et al. Journal of Power Sources. 2002, 107(1): 48-55.

Google Scholar

[3] N. Kaneko, M. Seki, S. Arai, et al. Electrochemistry. May 2001, 69(5): 329-334.

Google Scholar

[4] Guo, F., Lucas J.P.; Subramanian, K.N.: Journal of Materials Science: Materials in Electronics, 2004, 12(1): 27-35.

Google Scholar

[5] Yanfu Yan , Lifang Feng, Keke Zhang, Jiuba Wen: Tsinghua Science and Technology . 2007, 12 (3): 296-301. In Chinese.

Google Scholar

[6] Yanfu Yan, Hongxin Yan, Fuxiao Chen, Keke Zhang, Jinhong Zhu, China Welding, 2007, 16(1): 41-46. In Chinese. Acknowledgements Supported by the Natural science Foundation of Jiangsu Province (Grant No. 09KJD430012).

Google Scholar