Control Factor Selection and Solder Residue Problem Study in Flip Chip Process

Abstract:

Article Preview

Info:

Periodical:

Advanced Materials Research (Volumes 154-155)

Edited by:

Zhengyi Jiang, Xianghua Liu and Jinglong Bu

Pages:

1804-1812

DOI:

10.4028/www.scientific.net/AMR.154-155.1804

Citation:

J. L. Kuo and C.-C. Kuo, "Control Factor Selection and Solder Residue Problem Study in Flip Chip Process", Advanced Materials Research, Vols. 154-155, pp. 1804-1812, 2011

Online since:

October 2010

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.