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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 154-155Control Factor Selection and Solder Residue...

Control Factor Selection and Solder Residue Problem Study in Flip Chip Process

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Periodical:

Advanced Materials Research (Volumes 154-155)

Pages:

1804-1812

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.154-155.1804

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Online since:

October 2010

Authors:

Jian Long Kuo, Chun-Cheng Kuo

Keywords:

IC Manufacturing Process, Solder Bead, Solder Residue

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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[1] John H. Lau Express packaging system, Low cost Flip Chip technologies for DCA, WLSP and PBGA assemblies, (2002).

[2] John H. Lau Express packaging system. Inc, Solder joint reliability BGA, CSP, Flip Chip and fine pitch SMT assemblies, (2002).

[3] Ning-Cheng Lee, Reflow soldering process and troubleshooting: SMT, BGA, CSP and Flip Chip Technologies, (2001).

DOI: 10.1108/mi.2003.21820aae.003

[4] Leandro G. Barajas, Process Control in High-Noise Environments Using a Limited Number of Measurements，School of Electrical and Computer Engineering Georgia Institute of Technology Atlanta GA, 30332, (2002).

DOI: 10.17775/cseejpes.2016.00043

[5] T. A. Nguty, N. N. Ekere, and A. Adebayo, 1999, Correlating Solder Paste Composition with Stencil Printing Performance，Electronics Manufacturing Engineering Research Group Department of Aeronautical, Mechanical and Manufacturing Engineering University of Salford, (1999).

DOI: 10.1109/iemt.1999.804837

[6] John H. Lau, Express packaging system, Low cost Flip Chip technologies for DCA, WLSP and PBGA assemblies, (2000).