Properties of Two Lead-Free Solder Alloys and Comparison with Sn37Pb

Tian Han Xu; Mai Qun Zhao; Dang Hui Wang

doi:10.4028/www.scientific.net/AMR.154-155.540

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 154-155Properties of Two Lead-Free Solder Alloys and...

Properties of Two Lead-Free Solder Alloys and Comparison with Sn37Pb

Abstract:

The microstructures and properties of Sn3Ag2.8Cu and Sn3Ag2.8Cu-0.1Ce solder alloys were investigated by means of OM, SEM and EDX and compared to that of Sn37Pb. The results show that the wettability of Sn3Ag2.8Cu-0.1Ce is more favorable, Sn3Ag2.8Cu exhibits poorer wetting behaviour compared to that of Sn37Pb solder; the conductivities of Sn3Ag2.8Cu-0.1Ce and Sn3Ag2.8Cu soldesr are almost 20 percent and 8 percent higher than that of Sn37Pb respectively; the fractography of tensile specimen of Sn3Ag2.8Cu is smooth and light, and is a quasi-cleavage fracture mechanism, whereas that of Sn3Ag2.8Cu-0.1Ce is dark and rough, and has a fibrous pattern, and is a ductile fracture mechanism; the fractography of Sn3Ag2.8Cu-0.1Ce includes more compact and more uniform dimples than that of Sn3Ag2.8Cu, this is cause of the trace amounts of Ce refining the microstructure; brazing with the Cu substrate, the diffusion layer of Sn3Ag2.8Cu solder with Cu substrate includes more irregular IMC compared to Sn3Ag2.8Cu-0.1Ce and Sn37Pb..

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Periodical:

Advanced Materials Research (Volumes 154-155)

Pages:

540-544

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.154-155.540

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Online since:

October 2010

Authors:

Tian Han Xu, Mai Qun Zhao, Dang Hui Wang

Keywords:

Diffusion Layer Thickness, Lead-Free Solder, Microstructure, Property Analysis

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