Plasma Surface Modification of Silica and its Application in Epoxy Molding Compounds for Large-Scale Integrated Circuits Packaging

Abstract:

The surface modification of silica for epoxy molding compounds (EMC) was conducted by plasma polymerization using RF plasma (13.56MPa), and the modification factors such as plasma power, gas pressure and treatment time were investigated systematically in this paper. The monomers utilized for the plasma polymer coatings were pyrrole, 1,3-diaminopropane, acrylic acid and urea. The plasma polymerization coating of silica was characterized by FTIR, contact angle. Using the silica treated by plasma as filler, ortho-cresol novolac epoxy as main resin, novolac phenolic-formaldehyde resin as cross-linking agent and 2-methylmizole as curing accelerating agent, the EMCs used for the packaging of large-scale integrated circuits were prepared by high-speed pre-mixture and twin roller mixing technology. The results have shown that the surface of silica can be coated by plasma polymerization of pyrrole, 1,3-diaminopropane, acrylic acid and urea, and the comprehensive properties of EMC were improved.

• Periodical: Advanced Materials Research (Volume 158)
• Pages: 184-188
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.158.184
• Online since: November 2010
• Authors: Ming Shan Yang, Lin Kai Li, Jian Guo Zhang
• Keywords: Epoxy Mold Compound (EMCs), Large-Scale Integrated Circuit Packaging, Plasma Polymerization Modification, Silica

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