Microstructural Evolution in Void Coalescence Induced by Plate-Impact Loading in Ultrapure Aluminum

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The evolution of microstructure and the mechanical response of ultrapure aluminum subjected to plastic deformation using plate-impact loading was investigated. For the High Purity Aluminum (99.999%), disk sample was shock impacted by a light gun. Observations by transmission electron microscopy reveal that the inside of the early voids consists of nanometer aluminum; it is proposed that they are the result of recrystallization occurring during localization. And some texture may come from the high temperature annealing the secondary grain crystallization behavior and crystallization when the tensile stress effect. This discovery is helpful to the study on the mechanism during the early stage of void nucleation and growth which produced by tensile fracture.

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Periodical:

Advanced Materials Research (Volumes 160-162)

Edited by:

Guojun Zhang and Jessica Xu

Pages:

434-439

Citation:

D. Fan and M. L. Qi, "Microstructural Evolution in Void Coalescence Induced by Plate-Impact Loading in Ultrapure Aluminum", Advanced Materials Research, Vols. 160-162, pp. 434-439, 2011

Online since:

November 2010

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$38.00

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