Numerical Simulation for the Thermal Stress of Composite Wall Insulation System

Abstract:

This paper presents the thermal stress characteristics of polystyrene plate - thin plaster wall. Based on thermal stress analysis module of ANSYS software, a three-dimensional element solid5 is selected to mesh the wall model, which can simulate the coupling effects of thermal stress and structural stress field. The critical temperature of hot and cold cycles is taken as the critical temperature condition, which is imposed on the calculation model. Windowless Wall and window wall were modeled separately. Temperature field, thermal stress, and deformation distribution were proposed after comparing and analyzing the two simulation results. Numerical simulation results indicate that: (1) Whether in high or low temperatures, window or windowless, polystyrene plates thin plaster wall insulation system has very good thermal insulation properties；(2) Polystyrene plate - thin plaster wall insulation system is influenced by the temperature stress. Different stress fields concentrate significantly around windows and in the middle of wall especially around the windows. In fact, it is relatively same as the law of cracks around the windows.

• Periodical: Advanced Materials Research (Volumes 168-170)
• Pages: 875-879
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.168-170.875
• Online since: December 2010
• Authors: Tao Cheng, Ke Qin Yan
• Keywords: Coupling, Polystyrene Plate - Thin Plaster Wall, Stress Field, Temperature Field, Thermal Insulation, Thermal Stress

References

[1] Abdou, A. A. and I. M. Budaiwi. Comparison of thermal conductivity measurements of building insulation materials under various operating temperatures [J]. Journal of Building Physics. 2005, 29(Compendex): 171-184.

DOI: 10.1177/1744259105056291

[2] Zhu, Z., J. Zong, et al. Long-term thermal insulation performance of polystyrene foam boards with decay of blowing agents [J]. Society of Plastics Engineers Annual Technical Conference. 2007, 5.

[3] Fricke, J. Schwab, H. Heinemann, U. Vacuum insulation panels - Exciting thermal properties and most challenging applications[J]. International Journal of Thermophysics. 2006, 27(Compendex ): 1123-1139.

DOI: 10.1007/s10765-006-0106-6

[4] Skobelkina, T. N., V. G. Yurchenko, et al. Thermal conductivity of quickly removable thermal insulation [J]. Atomic Energy . 2005, 99(Compendex): 676-679.

DOI: 10.1007/s10512-005-0265-8

[5] Bai, D. and X. J. Fan. Numerical simulation of coupled heat transfer in thermal insulation with non-gray media for metallic thermal protection systems[J]. Journal of Nanjing University of Aeronautics and Astronautics 37 (Compendex): 403-407.