Taking Sn as the third element in the Al/Pb immiscible system, the Al-Sn-Pb layered composite materials at different temperatures were prepared by solid-liquid coating method. Microstructure of the layered composite materials was studied by scanning electron microscope (SEM) and Energy Dispersive Spectrometer (EDS), and then the flexural strength and interface adhesion of the layered composite materials were measured. The results showed that, introducing of Sn reduced the enthalpy heat of mixing of Al/Pb system to be negative, and inter-diffusion of elements in the interface region occurred, and a metallurgical bonding interface between Pb and Al formed. The optimum diffusion-sintering temperature-time for the best flexural strength were determined by 250οС , 0.5h, respectively. Under the controlled conditions, the mechanism was discussed.