Preliminary Research on Interfacial Evolution Behaviour of Ti-Cu Laminated Composite Materials

Abstract:

Ti-Cu laminated composites were fabricated by means of vacuum hot pressing (VHP). The Ti-Cu interfacial reaction was studied to observe the microstructural changes. Scanning Electron Microscopy (SEM), Energy Disperse Spectroscopy (EDS) and X-Ray Diffraction (XRD) were used to observe morphology and analyze phase composition of interfacial reaction zones. With increasing the holding time, the thickness of the reaction zones varies from 12μm to 16μm. The results show that there are 5 binary intermetallic compounds (Cu₄Ti, Cu₄Ti₃, CuTi, Cu₃Ti₂, CuTi₂) observed in the Ti-Cu diffusion couples held at 1073 K for 1h, 1.5h, 2h and 2.5h respectively under the pressure of 10MPa.

• Periodical: Advanced Materials Research (Volumes 194-196)
• Pages: 1615-1619
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.194-196.1615
• Online since: February 2011
• Authors: Hong Mei Yang, Pei Xian Zhu, Sheng Gang Zhou, Jian Xu, Hui Yu Ma, Jia Xin Guo
• Keywords: Interfacial Reaction, Intermetallic Compound (IMC), Microstructure, Ti-Cu Laminated Composite

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