Synthesis of Phosphazene Flame Retardant and its Application in Epoxy Molding Compound for Large-Scale Integrated Circuit Packaging

Ming Shan Yang; Jian Wei Liu; Lin Kai Li

doi:10.4028/www.scientific.net/AMR.216.474

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 216Synthesis of Phosphazene Flame Retardant and its...

Synthesis of Phosphazene Flame Retardant and its Application in Epoxy Molding Compound for Large-Scale Integrated Circuit Packaging

Abstract:

The tri(o-phenylenediamine) cyclotriphosphazene (TPCTP) was synthesized using titrating technology of hexachlorocyclotriphosphazene solution and the synthesis parameters were investigated, and the structure of TPCTP was analyzed by FTIR in this paper. Using TPCTP synthesized in the work as flame retardant, the epoxy molding compound(EMC) for packaging of large-scale integrated circuits with halogen-free flame retardance was prepared. The results have shown that the flame retardance of EMC flame-retardanced by TPCTP was up to UL 94 V0 rating(1.6mm) and the oxygen index of the EMC was up to 34.5%, which indicates that TPCTP has much better flame retardance for EMC than traditional halogen flame-retardants. Meanwhile, TPCTP accelerated the curing reaction rate of EMC, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.

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Periodical:

Advanced Materials Research (Volume 216)

Pages:

474-478

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.216.474

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Online since:

March 2011

Authors:

Ming Shan Yang, Jian Wei Liu, Lin Kai Li

Keywords:

Environmentally Friendship Retardance, Epoxy Molding Compound, Large-Scale Integrated Circuit Packaging, Tri(o-Phenylenediamine) Cyclotriphosphazene

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References

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