Effect of Electromagnetic Field on the Solidification Structure of Copper-Iron Alloys

Bao Mian Li; Hai Tao Zhang; Jian Zhong Cui

doi:10.4028/www.scientific.net/AMR.217-218.1492

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 217-218Effect of Electromagnetic Field on the...

Effect of Electromagnetic Field on the Solidification Structure of Copper-Iron Alloys

Abstract:

The effect of electromagnetic field and iron content on the solidification structure of copper-iron alloys had been investigated in this paper. The results show that the addition of iron to copper causes considerable grain refinement, and the refinement increases with the iron content. Applying electromagnetic field during the solidification of Cu-Fe alloys can further refine grain of hepoperitectic alloys, but has no obvious effect on the grain size of heperperitectic alloys. Primary γ-Fe dendrites are gradually broken and scattered uniformly throughout the matrix under the influence of electromagnetic field. When the current intensity is 200A, the primary γ-Fe appears as fine petal shape distributed uniformly over the matrix.

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Periodical:

Advanced Materials Research (Volumes 217-218)

Pages:

1492-1496

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.217-218.1492

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Online since:

March 2011

Authors:

Bao Mian Li, Hai Tao Zhang, Jian Zhong Cui

Keywords:

Copper-Iron Alloy, Electromagnetic Field (EMF), Grain Refinement, Solidification Structure

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References

[1] W. Y. Xiang, X. Z. Chen and T. C. Kuang. Materials Review Vol. 20 (2006), P. 20. (in Chinese).

Google Scholar

[2] H. I. Hong. Advanced Engineering Materials Vol. 3 (2001), P. 475.

Google Scholar

[3] A. Mori, T. Suzuki. Journal of the JRICu Vol. 41 (2002), P. 204. (in Japanese).

Google Scholar

[4] J. He, J. Z. Zhao. Acta Metallurgica Sinica Vol. 41 (2005), P. 407. (in Chinese).

Google Scholar

[5] G. J. Huang, S. S. Xie and Z. K. Cheng. Journal of Guangdong Nonferrous Metals Vol. 15 (2005), P. 574.

Google Scholar

[6] J. P. Ge, H. Zhao and Z. Q. Yao. Trans. Nonferrous Met. Soc. China Vol. 15 (2005), P. 971.

Google Scholar

[7] Y. T. Zhang, M. Zhang. Heat Treatment of Metals Vol. 31 (2006), P. 68. (in Chinese).

Google Scholar

[8] J. Szajnar, M. Stawarz and T. Wrobbel. Journal of Achievements in Materials and manufacturing Engineering Vol. 34 (2009), P. 95.

Google Scholar

[9] J. A. Patchett, G. J. Abbaschian. Metall. Trans. Vol. 16B (1985), P. 505.

Google Scholar

[10] C. Vives. Metall. Trans. Vol. B20 (1989), P. 623.

Google Scholar

[11] D. N. Riahi. J. Cryst. Growth Vol. 216 (2000), P. 501.

Google Scholar

[12] W. J. Boettinger, S. R. Coriell and A. L. Greer. Acta Mater. Vol. 48 (2000) P. 43.

Google Scholar

[13] G. Hansen, A. Hellawell and S. Z. Lu. Metall. Trans. Vol. A27 (1996), P. 569.

Google Scholar

[14] H. Conrad. Mater. Sci. Eng. Vol. A287 (2000), P. 205.

Google Scholar