Effect of Electromagnetic Field on the Solidification Structure of Copper-Iron Alloys

Abstract:

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The effect of electromagnetic field and iron content on the solidification structure of copper-iron alloys had been investigated in this paper. The results show that the addition of iron to copper causes considerable grain refinement, and the refinement increases with the iron content. Applying electromagnetic field during the solidification of Cu-Fe alloys can further refine grain of hepoperitectic alloys, but has no obvious effect on the grain size of heperperitectic alloys. Primary γ-Fe dendrites are gradually broken and scattered uniformly throughout the matrix under the influence of electromagnetic field. When the current intensity is 200A, the primary γ-Fe appears as fine petal shape distributed uniformly over the matrix.

Info:

Periodical:

Advanced Materials Research (Volumes 217-218)

Edited by:

Zhou Mark

Pages:

1492-1496

DOI:

10.4028/www.scientific.net/AMR.217-218.1492

Citation:

B. M. Li et al., "Effect of Electromagnetic Field on the Solidification Structure of Copper-Iron Alloys", Advanced Materials Research, Vols. 217-218, pp. 1492-1496, 2011

Online since:

March 2011

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Price:

$35.00

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