Study on Preparation and Application of High-Performance Cu-Al Composite Row

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Abstract:

Cu-Al composite row was produced by continuous cast-rolling technique and metallurgical bonding interface was achieved. The microstructure of interface and the composite mechanism was investigated. Isolating switch was fabricated by using copper-aluminum composite row as current-carrying conductor. Main performance index and technical parameters were evaluated. The composite row shows excellent mechanical property and conductivity: overall tensile strength of 102MPa, elastic modulus of 1.5GPa, resistance rate of 0.0216Ωmm2/m and carrier density of 750A. The results present that the temperature rise, circuit resistance, mechanical life and other properties of the copper-aluminum composite row can meet the requirements of being the current-carrying conductor of isolating switch.

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Periodical:

Advanced Materials Research (Volumes 217-218)

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1716-1720

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March 2011

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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[1] D.Y. Ying, D.L. Zhang: J. Alloys Compd. Vol. 311, 2000, P. 275.

Google Scholar

[2] H. L. Wang, Th. Wagner and G. Eska: Physica B. Vol. 284-288(2000), P. (2024).

Google Scholar

[3] M. Abbasi, A.Karimi Taheri,M. T. Salehi: J. Alloys Compd. Vol. 319(2001), P. 233.

Google Scholar

[4] B.L. Won S.B. Kuek B.J. Seung: J. Alloys Compd. Vol. 390(2005), P. 212.

Google Scholar

[5] Y. Tanaka, M. Kajihara: Mater. Trans. Vol. 47 (2006), P. 2480.

Google Scholar

[6] H. Dyja, S. Mróz, A. Milenin: J. Mater. Process. Technol., Vol. 153-154(2004), P. 100.

Google Scholar

[7] H. Dyja, L. Lesik, A. Milenin, S. Mróz,: J. Mater. Process. Technol., Vol. 125–126 (2002), P. 731.

Google Scholar

[8] Y. Tanaka, M. Kajihara and Y. Watanabe: Mater. Sci. Eng. A. Vol. 445(2007), P. 355.

Google Scholar

[9] Y. Tanaka, T. Goto, Y. Watanabe, Mater. Sci. Forum. Vol. 492–493 (2005), P. 737.

Google Scholar

[10] X.J. Liu, I. Ohnuma, R. Kainuma and K. Ishida: J. Alloys Compd. Vol. 264(1998), P. 201.

Google Scholar