Measurement of Dynamic and Static Modulus for Thin Particleboard

Hai Cheng Yan; Hou Jiang Zhang; Lei Zhu; Yan Liang Sun

doi:10.4028/www.scientific.net/AMR.217-218.402

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 217-218Measurement of Dynamic and Static Modulus for Thin...

Measurement of Dynamic and Static Modulus for Thin Particleboard

Abstract:

This document explains and demonstrates a new means of dynamic and static bending evaluation of modulus of elasticity for small samples of thin wood composites. This means is based on the principle of cantilever-beam bending and free vibration, and a cantilever beam testing apparatus has been developed according to this principle. Three kinds of thin particleboard obtained from market were processed and tested. The testing results show that there are significant linear correlations between the cantilever dynamic modulus and the static bending modulus. Through this method, it is feasible to measure the modulus of elasticity for thin wood composites, and compared with traditional method, the static bending test; it can save more time and reduce damage.

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Periodical:

Advanced Materials Research (Volumes 217-218)

Pages:

402-406

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.217-218.402

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Online since:

March 2011

Authors:

Hai Cheng Yan, Hou Jiang Zhang, Lei Zhu, Yan Liang Sun

Keywords:

Cantilever-Beam Bending, Cantilever-Beam Vibration, Dynamic Modulus, Static Bending Modulus, Thin Particleboard

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