Growth Kinetics of Intermetallic Compounds at the Interface of Liquid Sn-9Zn/Cu

Abstract:

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The morphology and growth of the intermetallic compound (IMC) formed between liquid Sn-9Zn eutectic solder alloy and Cu at 220-260°C was investigated. Experimental results showed that γ-Cu5Zn8 was present at the Sn-9Zn/Cu interface as the reaction product. The IMC layer growth follows the parabolic-growth law, which indicates that the growth of the IMC is controlled by the diffusion mechanisms. The activation energy of γ-Cu5Zn8 layer growth for liquid Sn-9Zn reacting with Cu substrate is determined as 50.5 KJ/mol.

Info:

Periodical:

Advanced Materials Research (Volumes 233-235)

Edited by:

Zhong Cao, Lixian Sun, Xueqiang Cao, Yinghe He

Pages:

2323-2327

DOI:

10.4028/www.scientific.net/AMR.233-235.2323

Citation:

H. Z. Huang et al., "Growth Kinetics of Intermetallic Compounds at the Interface of Liquid Sn-9Zn/Cu", Advanced Materials Research, Vols. 233-235, pp. 2323-2327, 2011

Online since:

May 2011

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Price:

$35.00

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