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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 233-235Growth Kinetics of Intermetallic Compounds at the...

Growth Kinetics of Intermetallic Compounds at the Interface of Liquid Sn-9Zn/Cu

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Abstract:

The morphology and growth of the intermetallic compound (IMC) formed between liquid Sn-9Zn eutectic solder alloy and Cu at 220-260°C was investigated. Experimental results showed that γ-Cu₅Zn₈ was present at the Sn-9Zn/Cu interface as the reaction product. The IMC layer growth follows the parabolic-growth law, which indicates that the growth of the IMC is controlled by the diffusion mechanisms. The activation energy of γ-Cu₅Zn₈ layer growth for liquid Sn-9Zn reacting with Cu substrate is determined as 50.5 KJ/mol.

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Periodical:

Advanced Materials Research (Volumes 233-235)

Pages:

2323-2327

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.233-235.2323

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Online since:

May 2011

Authors:

Hui Zhen Huang, Xiu Qin Wei, Lang Zhou

Keywords:

Activation Energy, Intermetallic Compound (IMC), Kinetic, Sn-Zn Alloy

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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