Mechanical Properties of a Microcapsule-Containing Epoxy for Self-Healing Applications

Xing Liu; Jong Keun Lee

doi:10.4028/www.scientific.net/AMR.239-242.1794

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 239-242Mechanical Properties of a Microcapsule-Containing...

Mechanical Properties of a Microcapsule-Containing Epoxy for Self-Healing Applications

Abstract:

The addition of microencapsulated healing agent or catalyst in a polymer matrix can potentially change its mechanical properties and processing characteristics. The extent of this change depends on the volume fraction of the additives, the level of interfacial interaction, and the inherent properties of the additives. For a self-healing concept to be viable, the healing performance should be achieved without compromising the overall processing and mechanical properties of the polymer matrix. In this study, tensile and dynamic mechanical properties were investigated and discussed for an amine-cured epoxy dispersed with different loadings of microcapsules.

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Periodical:

Advanced Materials Research (Volumes 239-242)

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1794-1798

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https://doi.org/10.4028/www.scientific.net/AMR.239-242.1794

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Online since:

May 2011

Authors:

Xing Liu, Jong Keun Lee

Keywords:

Epoxy, Mechanical Property, Microcapsule, Self-Healing

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