Mathematic Model of Recrystallization of Cu-20Ni-5Sn Alloy

Abstract:

Research the kinetic mechanism of grain growth of recrystallization of Cu-20Ni-5Sn alloy. The research result shows that the recrystallization temperature declines with the increase of cold-deformation. The recrystallization temperature is at about 500°C ~650°C respectively for 50% and 60% total cold deformation, and is about 470°C ~620°C respectively for 70% and 85% total deformation. The grains grow up with the increase of annealing temperature and holding time. The mathematic model of average grain size can be described as that Cu-20Ni-5Sn alloy annealed at 620°C ~680°C holding 2~10hours.

• Periodical: Advanced Materials Research (Volumes 239-242)
• Pages: 2252-2256
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.239-242.2252
• Online since: May 2011
• Authors: Rui Qing Liu, Lijun Peng, Jian Sheng Yang
• Keywords: Cu-20Ni-5Sn Alloy, Grain Growth, Hardness, Mathematics Model, Microstructure, Recrystallization Temperature

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