Mathematic Model of Recrystallization of Cu-20Ni-5Sn Alloy
Research the kinetic mechanism of grain growth of recrystallization of Cu-20Ni-5Sn alloy. The research result shows that the recrystallization temperature declines with the increase of cold-deformation. The recrystallization temperature is at about 500°C ~650°C respectively for 50% and 60% total cold deformation, and is about 470°C ~620°C respectively for 70% and 85% total deformation. The grains grow up with the increase of annealing temperature and holding time. The mathematic model of average grain size can be described as that Cu-20Ni-5Sn alloy annealed at 620°C ~680°C holding 2~10hours.
Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He
R. Q. Liu et al., "Mathematic Model of Recrystallization of Cu-20Ni-5Sn Alloy", Advanced Materials Research, Vols. 239-242, pp. 2252-2256, 2011