The Activate Processe of Ni-P Electroless Plating on the Surface of SiC Particles

Abstract:

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The surface of SiC particles were modified by electroless plating. To avoid complicated activation and sensitization process before nickel-phosphorus chemical plating, a special process was adopted in experiment. After experiments, the metallographic structure was characterized by using SEM and EDS, respectively. The results show that SiC particles modified by Ni-P alloy are obtained after a simple and specific process of SiC particles activation.

Info:

Periodical:

Advanced Materials Research (Volumes 239-242)

Edited by:

Zhong Cao, Xueqiang Cao, Lixian Sun, Yinghe He

Pages:

2859-2862

DOI:

10.4028/www.scientific.net/AMR.239-242.2859

Citation:

J. Y. Hou and D. Yang, "The Activate Processe of Ni-P Electroless Plating on the Surface of SiC Particles", Advanced Materials Research, Vols. 239-242, pp. 2859-2862, 2011

Online since:

May 2011

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$35.00

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