The Activate Processe of Ni-P Electroless Plating on the Surface of SiC Particles

Jun Ying Hou; Di Yang

doi:10.4028/www.scientific.net/AMR.239-242.2859

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 239-242The Activate Processe of Ni-P Electroless Plating...

The Activate Processe of Ni-P Electroless Plating on the Surface of SiC Particles

Abstract:

The surface of SiC particles were modified by electroless plating. To avoid complicated activation and sensitization process before nickel-phosphorus chemical plating, a special process was adopted in experiment. After experiments, the metallographic structure was characterized by using SEM and EDS, respectively. The results show that SiC particles modified by Ni-P alloy are obtained after a simple and specific process of SiC particles activation.