The No-Cyanide Copper Electroplating with Dipping-Plating Pretreatment

Xue Jiao Tang; Ai Hong Guo; Jin Gang Wang; Min Gao; Bo Xiong Shen

doi:10.4028/www.scientific.net/AMR.239-242.3186

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The No-Cyanide Copper Electroplating with Dipping-Plating Pretreatment

Abstract:

The acid dipping-plating pretreatment was applied on iron substrate prior to no-cyanide copper plating process. After being pretreated in dipping solution, the thin copper film formed on iron substrate which could change the cathode electronic potential and enhance the copper plating rate in the follow-up copper electroplating. As a comparation, the iron substrate was directly electroplated in another copper plating bath without dipping-plating pretreatment (DPr). The effects of temperature and electric current density on the copper plating rate were investigated in both process with DPr and process without DPr. And the mechanism was discussed.

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Periodical:

Advanced Materials Research (Volumes 239-242)

Pages:

3186-3189

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.239-242.3186

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Online since:

May 2011

Authors:

Xue Jiao Tang, Ai Hong Guo, Jin Gang Wang, Min Gao, Bo Xiong Shen

Keywords:

Copper Electroplating, Dipping Pretreatment, Iron Substrate, No-Cyanide, Pyrophosphate-Base Electroplating

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