Optimizing of Pretreatment Process of Electroless Ni-P Plating on Aluminum Substrate

Guan Jun Liu; Zhou Yu; Jun Cao

doi:10.4028/www.scientific.net/AMR.239-242.860

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 239-242Optimizing of Pretreatment Process of Electroless...

Optimizing of Pretreatment Process of Electroless Ni-P Plating on Aluminum Substrate

Abstract:

In order to improve and simplify the process of electroless Ni-P plating on aluminum substrate, a activated solution and process were optimized by orthogonal test, the plating morphology were analysed using Quanta 200 type scanning electron microscope. The bond between the plating and aluminum substrate were evaluated using method of water quenching and alternating bending test. The results show that good coating can be obtained on aluminum substrate under the normal condition of the acid electroless Ni-P plating solution with sulfuric acid of 120g/L and nitric acid of 10-15g/L as activated solution and activated time of 20 min. And the good bond between the plating and aluminum substrate was obtained.

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Periodical:

Advanced Materials Research (Volumes 239-242)

Pages:

860-863

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.239-242.860

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Online since:

May 2011

Authors:

Guan Jun Liu, Zhou Yu, Jun Cao

Keywords:

Aluminum Substrate, Electroless Ni-P Plating, Optimizing, Orthogonal Test

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