The Thermal Induced Temperature and Stress Damage

Ai Fei Li; Si Hai Luo; Yue Gui

doi:10.4028/www.scientific.net/AMR.255-260.3

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 255-260The Thermal Induced Temperature and Stress Damage

The Thermal Induced Temperature and Stress Damage

Abstract:

During the Canister Retrieval Test (CRT), the temperature around the deposition hole DD0092G01 was elevated and the stress in the rock was consequently increased. This report concerns the study to investigate if the increased stress around the deposition hole has led to micro fracturing in the surrounding rock and if the temperature and possible heat induced damage can be predicted by numerical simulation.The temperature field from thermal analysis generally matches the measured results well, whereas the calculated temperature is much higher than measured.The damage analysis might be a quite reasonable simplification for the area near the middle height of the hole. For the other part, the influence due to tunnel excavation or the end effect should have more important influence.

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Periodical:

Advanced Materials Research (Volumes 255-260)

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3-8

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.255-260.3

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Online since:

May 2011

Authors:

Ai Fei Li, Si Hai Luo, Yue Gui

Keywords:

CRT, FLAC, Numerical Simulation, Stress Damage, Temperature

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References

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