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Effect of Electromagnetic Field on the Solidification Structure of C70250 Copper Alloy

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Abstract:

The effect of electromagnetic field on the solidification structure of C70250 copper alloy (Cu-3.2%Ni-0.8%Si in mass%) had been investigated in this paper. The results show that applying electromagnetic field during the solidification of C70250 copper alloy can refine as-cast structure and δ-Ni2Si phase. The morphology of δ-Ni2Si phase changes from coarse massive shape to fine dotlike shape. The above-mentioned effects become more obvious with the increasing in current intensity.

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Periodical:

Advanced Materials Research (Volumes 287-290)

Pages:

2744-2747

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.287-290.2744

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Online since:

July 2011

Authors:

Bao Mian Li, Hai Tao Zhang, Jian Zhong Cui

Keywords:

Copper Alloy, Electromagnetic Field (EMF), Solidification Structure

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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