Effect of Electromagnetic Field on the Solidification Structure of C70250 Copper Alloy

Abstract:

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The effect of electromagnetic field on the solidification structure of C70250 copper alloy (Cu-3.2%Ni-0.8%Si in mass%) had been investigated in this paper. The results show that applying electromagnetic field during the solidification of C70250 copper alloy can refine as-cast structure and δ-Ni2Si phase. The morphology of δ-Ni2Si phase changes from coarse massive shape to fine dotlike shape. The above-mentioned effects become more obvious with the increasing in current intensity.

Info:

Periodical:

Advanced Materials Research (Volumes 287-290)

Edited by:

Jinglong Bu, Pengcheng Wang, Liqun Ai, Xiaoming Sang, Yungang Li

Pages:

2744-2747

DOI:

10.4028/www.scientific.net/AMR.287-290.2744

Citation:

B. M. Li et al., "Effect of Electromagnetic Field on the Solidification Structure of C70250 Copper Alloy", Advanced Materials Research, Vols. 287-290, pp. 2744-2747, 2011

Online since:

July 2011

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Price:

$35.00

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