Preparation of RPSL-01 Type Photosensitive Resin for Stereolithography and Study on its some Properties

Bi Wu Huang; Zi Xiang Weng; Shi Min Liu; Wei Qing Chen

doi:10.4028/www.scientific.net/AMR.287-290.386

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 287-290Preparation of RPSL-01 Type Photosensitive Resin...

Preparation of RPSL-01 Type Photosensitive Resin for Stereolithography and Study on its some Properties

Abstract:

RPSL-01 type photosensitive resin for Stereolithography was prepared with 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate (UVR 6110), bisphenol A type epoxy diacrylate (EA-612), tripropylene glycol diacrylate (TPGDA), pentaerythritol triacrylate(PETA), triethylene glycol divinyl ether (DVE-3), benzil dimethyl ketal (Irgacure651) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976) as raw materials. Some properties of the photosensitive resin were investigated. The viscosity of the photosensitive resin at 30°C was 425mP_a.S, The glass transition temperature (Tg ) of the UV-cured specimen was 47°C, and the weight loss of the UV-cured specimen at 200°C was less than 5%. The photosensitive resin and its UV-cured specimen were also characterized by infrared (IR).

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Periodical:

Advanced Materials Research (Volumes 287-290)

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386-389

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.287-290.386

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Online since:

July 2011

Authors:

Bi Wu Huang, Zi Xiang Weng, Shi Min Liu, Wei Qing Chen

Keywords:

Laser, Photosensitive Resin, Property Analysis, Stereolithography

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