Preparation of RPSL-01 Type Photosensitive Resin for Stereolithography and Study on its some Properties

Abstract:

Article Preview

RPSL-01 type photosensitive resin for Stereolithography was prepared with 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate (UVR 6110), bisphenol A type epoxy diacrylate (EA-612), tripropylene glycol diacrylate (TPGDA), pentaerythritol triacrylate(PETA), triethylene glycol divinyl ether (DVE-3), benzil dimethyl ketal (Irgacure651) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976) as raw materials. Some properties of the photosensitive resin were investigated. The viscosity of the photosensitive resin at 30°C was 425mPa.S, The glass transition temperature (Tg ) of the UV-cured specimen was 47°C, and the weight loss of the UV-cured specimen at 200°C was less than 5%. The photosensitive resin and its UV-cured specimen were also characterized by infrared (IR).

Info:

Periodical:

Advanced Materials Research (Volumes 287-290)

Edited by:

Jinglong Bu, Pengcheng Wang, Liqun Ai, Xiaoming Sang, Yungang Li

Pages:

386-389

DOI:

10.4028/www.scientific.net/AMR.287-290.386

Citation:

B. W. Huang et al., "Preparation of RPSL-01 Type Photosensitive Resin for Stereolithography and Study on its some Properties", Advanced Materials Research, Vols. 287-290, pp. 386-389, 2011

Online since:

July 2011

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.