Experimental Study of the Packaging Failure for Optical Fiber Arrays

Abstract:

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Optical fiber array is a key component in the assembly of planar optical waveguide devices and enable greater channel counts than previously. However, assembling optical fiber array has been a challenge due to the stringent performance and reliability requirements posed by optical fiber communication applications. This paper investigates the causes of the failures involving the adhesive including: surface contamination, air entrapment, uneven curing, curing shrinkage; and thermal expansion coefficient mismatch.

Info:

Periodical:

Advanced Materials Research (Volumes 295-297)

Edited by:

Pengcheng Wang, Liqun Ai, Yungang Li, Xiaoming Sang and Jinglong Bu

Pages:

1594-1599

DOI:

10.4028/www.scientific.net/AMR.295-297.1594

Citation:

J. A. Duan and Y. Zheng, "Experimental Study of the Packaging Failure for Optical Fiber Arrays", Advanced Materials Research, Vols. 295-297, pp. 1594-1599, 2011

Online since:

July 2011

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Price:

$35.00

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