Experimental Study of the Packaging Failure for Optical Fiber Arrays

Ji An Duan; Yu Zheng

doi:10.4028/www.scientific.net/AMR.295-297.1594

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 295-297Experimental Study of the Packaging Failure for...

Experimental Study of the Packaging Failure for Optical Fiber Arrays

Abstract:

Optical fiber array is a key component in the assembly of planar optical waveguide devices and enable greater channel counts than previously. However, assembling optical fiber array has been a challenge due to the stringent performance and reliability requirements posed by optical fiber communication applications. This paper investigates the causes of the failures involving the adhesive including: surface contamination, air entrapment, uneven curing, curing shrinkage; and thermal expansion coefficient mismatch.

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Periodical:

Advanced Materials Research (Volumes 295-297)

Pages:

1594-1599

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.295-297.1594

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Online since:

July 2011

Authors:

Ji An Duan, Yu Zheng

Keywords:

Adhesive, Assembly, Experimental Observation, Failure, Optical Fiber Array

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