Study on Complex Helical Drill Grinding Using the Grinder with Tripod Parallel Universal Moving Platform

Ping Zou; Xu Lei Yang; Jin Zhong Xu; Ming Hu; Wen Yuan Tian

doi:10.4028/www.scientific.net/AMR.325.171

Paper Titles

Analysis of Specific Energy of TC18 and TA19 Titanium Alloys in Surface Grinding
p.147

Wear Characteristics of Various Diamond Tools in Cutting of Tungsten Carbide
p.153

Effect of Lubricants on Precision Planing of Tungsten Carbide Using Mono-Crystalline Diamond Tool
p.159

Creep-Feed Grinding of Tungsten Carbide by Using Resin-Bonded Nickel-Coated Diamond Wheel
p.165

Study on Complex Helical Drill Grinding Using the Grinder with Tripod Parallel Universal Moving Platform
p.171

Particularities of Grinding High Speed Steel Punching Tools
p.177

Dressing Process of Porous Self-Generation Superabrasive Tool
p.183

Influence of Picosecond Laser Touch Dressing of Electroplated Diamond Wheels on the Dressing of SiC Vitrified Bond Wheel
p.189

Analysis of EDD Accuracy for Profiling Metal-Bonded Grinding Wheels
p.195

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 325Study on Complex Helical Drill Grinding Using the...

Study on Complex Helical Drill Grinding Using the Grinder with Tripod Parallel Universal Moving Platform

Abstract:

It is necessary to develop complex helical drill point grinders in order to improve drilling quality and efficiency. In this paper, a new type of cutting tool grinder in which there is the tripod universal moving platform is developed, and complex helical drill grinding using the grinder is presented. In addition to complex helical drills, other cutting tools also can be ground using the grinder.

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Periodical:

Advanced Materials Research (Volume 325)

Pages:

171-176

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.325.171

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Online since:

August 2011

Authors:

Ping Zou, Xu Lei Yang, Jin Zhong Xu, Ming Hu, Wen Yuan Tian

Keywords:

Complex Helical Drill Point, Drill Point Grinding, Grinder

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