Forming Technology of Spiral Micro-Groove in Plane

Article Preview

Abstract:

A spiral micro-groove structure in plane was processed by P-E method in this paper. The shapes of groove structure was restricted by P-E depth aph and feed f. The influence aph and f on the height of fin and matching relation between aph and f were analyzed, and optimal value of aph and dph was obtained. The highest fin was achieved when dph was the optimal value in processing. Meanwhile, the effect of rotational speed n on the morphology of micro groove was studied.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 328-330)

Pages:

346-349

Citation:

Online since:

September 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2011 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] O. Leon, G. D. Mey and E. Dick. Journal of Enhanced Heat Transfer Vol. 6 (1999), pp.51-60.

Google Scholar

[2] A. Cavallini, C. D. Del, L. Doretti, G. A. Longo and L. Rossetto. Int J Refrig Vol. 6 (2000), pp.4-25.

Google Scholar

[3] C. K. YU, D. C. LU. International Journal of Heat and Mass Transfer Vol. 50 (2007) No. 17-18, pp.3624-3637.

Google Scholar

[4] H. Yu, B. Li and X. Zhang. Sensors and Actuators A: Physical Vol. 125 (2006) No. 2, pp.553-564.

Google Scholar

[5] A. Arcondeguy, G. Gasgnier, G. Montavon, B. Pateyron, A. Denoirjean, A. Grimaud and C. Huguet. Surface and Coatings Technology Vol. 202 (2008) No. 18, pp.4444-4448.

DOI: 10.1016/j.surfcoat.2008.04.024

Google Scholar

[6] O. K. Josephp, F. M. Karen, G. Yveline, T. Joaquin, V. K. Patrick and M. C. Gabriel. Microelectronic Engineering Vol. 50 (2000) No. 1-4, pp.473-479.

Google Scholar

[7] G. L. Scott, K. Massoud. International Journal of Heat and Mass Transfer Vol. 44 (2001) No. 22, pp.4287-4311.

Google Scholar

[8] D. N. Nitesh, H. B. Sushil and C. J. Richard. International Journal of Heat and Mass Transfer Vol. 49 (2006) No. 17-18, pp.2829-2839.

Google Scholar

[9] Y. Tang, Y. Chi, Z. P. Wan, X. K. Liu, J. Ch. Chen, X. X. Deng and L. Liu. Journal of Materials Processing Technology Vol. 203 (2008) No. 1-3, pp.548-553.

Google Scholar

[10] S. S. Murthy, Y. K. Joshi and W. Nakayama. IEEE Transactions on Components and Packaging Technologies Vol. 25 (2002) No. 1, pp.156-163.

Google Scholar

[11] A. K. Das, P. K. Das and P. Saha. Applied Thermal Engineering Vol. 29 (2009) No. 17-18, pp.3643-3653.

Google Scholar

[12] R. Moss, A. I. Kelly. International Journal of Heat Mass Transfer Vol. 13 (1970), pp.491-502.

Google Scholar

[13] J. H. Xiang, Y. Tang, B. Y. Ye, W. Zhou, H. Yan and Z. H. Hu. Transactions of Nonferrous Metals Society of China Vol. 19 (2009) No. 2, pp.335-340.

DOI: 10.1016/s1003-6326(08)60274-5

Google Scholar