Research of Sapphire Wafer Scribing by Using UV Laser

Article Preview

Abstract:

The Processing advantages of UV laser were discussed in this paper. A series of experiments were carried out, some good results was achieved, which proved UV laser is fit for sapphire wafer processing. Then how processing parameters affects machining quality was discussed, which provides guidance to machining practice. The formation of grooves with good surface quality can be achieved by selecting appropriate laser parameters.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

90-93

Citation:

Online since:

September 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2011 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] E. Gu, C.W. Jeon, H.W. Choi , G. Rice , M.D. Dawson: Thin Solid Films 453–454 (2004) 462–466

DOI: 10.1016/j.tsf.2003.11.133

Google Scholar

[2] Jeffrey P. Sercel: Proc. of SPIE Vol. 5713 (SPIE, Bellingham, WA, 2005). 397-401

Google Scholar

[3] Tai-Chang Chen, Robert B.Darling. Journal of Materials Processing Technology 169 (2005) 214–218

Google Scholar

[4] Tai-Chang Chen, Robert B.Darling. Journal of materials processing technology 198 (2008) 248–253

Google Scholar

[5] E.K. Illya, M.Knowles, E.Gu, M.D. Dawson: Applied Surface Science 249 (2005) 354–361

Google Scholar

[6] E.Gu,H.Howard: Applied Surface Science,2006:4897-4901.

Google Scholar