Optimization of the Process Conditions Based on Depositing Rate and Micro-Hardness for Electroless Ni-P-Nano SiC Composite Plating

Hong Wang

doi:10.4028/www.scientific.net/AMR.339.483

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 339Optimization of the Process Conditions Based on...

Optimization of the Process Conditions Based on Depositing Rate and Micro-Hardness for Electroless Ni-P-Nano SiC Composite Plating

Abstract:

The orthogonal test method has been used to study the effects of the concentration of SiC, the speed of mixing, the temperature and the surfactants on depositing rate and micro-hardness, and obtained the optimized technological scheme and fine Ni-P-SiC composite coating. The results showed that using citric acid-acetic acid as complexing agents can obtain high speed of depositing and homogeneous coating with SiC well-distributed. Among the technological parameters, the effects of temperature on depositing rate is biggest, and the surfactants is next; the effects of the concentration of SiC particles on micro-hardness is biggest, and the surfactants is next. Give consideration to depositing rate and stability of the liquid, the temperature should be controlled at 82±2°C, the concentration of SiC particles and surfactants should be controlled in 4g/L and 60mg/L.

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Advanced Materials Research (Volume 339)

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483-486

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https://doi.org/10.4028/www.scientific.net/AMR.339.483

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September 2011

Authors:

Hong Wang

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Depositing Rate, Electroless Composite Plating, Microhardness, Nanometer Sic

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