Effect of Internal Electrical Field on the Electrical Breakdown Properties of Contact Materials

Abstract:

In order to get a deep understanding of the effect of internal electrical field on the electrical breakdown properties of contact materials, two kinds of W-Cu and Cr-Cu joints were prepared in a vacuum sintering furnace. The vacuum breakdown tests were respectively performed at the interface of two joints and pure metal ends in an arc extinguishing chamber, and the surface morphologies after electrical breakdown 50 times were characterized by a scanning electron microscopy equipped with an energy dispersive spectroscopy. The results show that the breakdown strength at the interface is much larger than that of pure metal ends, and the breakdown site deviates from the interface. It is suggested that the existence of internal electrical field at the interface of two contact metals changes the electronic structure, and, thus, the electrical breakdown behavior is influenced.

• Periodical: Advanced Materials Research (Volume 346)
• Pages: 154-160
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.346.154
• Online since: September 2011
• Authors: Jun Ru Liu, Peng Xiao, Xian Hui Wang, Shu Hua Liang, Han Yang Liu
• Keywords: Breakdown Strength, Electrical Breakdown, Electronic Structure, Internal Electrical Field

References

[1] T. Shioiri, T. Kamikawaji, E. Kaneko, M. Homma, H. Takahashi, and I. Ohshima, Influence of electrode area on conditioning in vacuum gap breakdown, IEEE Trans. Dielectr. Elect. Insul., vol. 2, no. 2, p.317–320, Apr. (1995).

DOI: 10.1109/94.388258

[2] T. Shioiri, I. Ohshima, M. Honda, H. Okumura, H. Takahashi, and H. Yoshida, Impulse voltage field emission characteristics and breakdown dependency upon field strength in vacuum gaps, IEEE Trans. Power App. Syst., vol. 101, no. 10, p.4178–4184, Oct. (1982).

DOI: 10.1109/tpas.1982.317097

[3] T. Fugel and D. Koenig, Influence of grading capacitors on the breaking performance of a 24-kV vacuum breaker series design, IEEE Trans. Dielectr. Elect. Insul., vol. 10, no. 4, p.569–575, Aug. (2003).

DOI: 10.1109/tdei.2003.1219639

[4] T. Shioiri, Y. Niwa, T. Kamikawaji, and M. Homma, Investigation of breakdown breakdown probability distribution for double-break vacuum circuit breaker, in Proc. 20th Int. Symp. Discharges Elect. Insul. Vacuum, p.323–326, (2002).

DOI: 10.1109/isdeiv.2002.1027374

[5] N. Ide, O. Tanaka, S. Yanabu, S. Kaneko, S. Okabe, and Y. Matsui, Interruption characteristics of double-break vacuum circuit breakers, IEEE Trans. Dielectr. Electr. Insul., vol. 15, no. 4, p.1065–1072, Aug. (2008).

DOI: 10.1109/tdei.2008.4591229

[6] E. Dullni and E. Schade, Investigation of high-current interruption of vacuum circuit breakers, IEEE Trans. Elect. Insul., vol. 28, no. 4, p.607–620, Aug. (1993).

DOI: 10.1109/14.231543

[7] X. H. Yang, S. H. Liang, X. H. Wang, P. Xiao and Z. K. Fan, Effect of WC and CeO2 on microstructure and properties of W–Cu electrical contact material, Int. J. Refract. Met. Hard Mater., vol. 28, p.305–311, (2010).

DOI: 10.1016/j.ijrmhm.2009.11.009

[8] Y. P. Wang, L. N. Zhang, B. J. Ding, and J. E. Zhou , Effect of selective strengthening of CuCr contact materials on the breakdown strength in a short vacuum gap, Proceedings of the CSEE, vol. 19, no. 3, pp.46-49, Mar. (1999).

[9] C. Y. Zhang, Y. P. Wang, Z. M. Yang, Y. Guo and B. J. Ding, Microstructure and properties of vacuum induction melted CuCr25 alloys, J. Alloys Compd., vol. 366, p.289–292, (2004).

DOI: 10.1016/j.jallcom.2003.07.001

[10] Y. P. Wang and B. J. Ding, The Preparation and the Properties of Microcrystalline and Nanocrystalline CuCr Contact Materials, IEEE Trans. on components and packaging technology, vol. 22, no. 2, pp.467-472, Jun. (1999).

DOI: 10.1109/6144.796552

[11] F. Zhao , H. Xu, Z. M. Yang and B. J. Ding, Preparation of CuCr25 alloys through vacuum arcs melting and their properties, ．Trans．Nonferrous Met. ．Soc. ．China, vol. 10, no. 1, pp.73-75, (2000).

[12] X. H. Yang, S. M. Li, Z. K. Fan, S. H. Liang and P. Xiao, Properties of CuFeW Electrical Contact Materials, High Voltage Apparatus, vol. 44, no. 6, pp.537-540, Dec. (2008).

[13] Q. Huang, Solid Physics, Beijing, High Education Press, 1988, pp.288-290 (in Chinese).

[14] H. Gleiter, J. Weissmqller, O. Wollersheim, and R. Wqrschum, Nanocrystalline Materials: A Way To Solids With Tunable Electronic Structures And Properties?, Acta Mater., vol. 49, pp.737-745, (2001).

DOI: 10.1016/s1359-6454(00)00221-4

[15] J. Wang, C. Y. Zhang, H. Zhang, Z. M. Yang and B. J. Ding, CuCr25W1Ni2 contact material of vacuum interrupter, Trans Nonferrous Met Soc China, vol. 11, no2, pp.226-230, (2001).

[16] F. Z. Wang, F. Zhuge, H. Zhang and B. J. Ding, Effect of high content no-thoria addition on the properties of tungsten electrode, Mater. Res. Bull., vol. 38, pp.629-636, (2003).

DOI: 10.1016/s0025-5408(03)00005-9