Study on Nanometric Machining Mechanism of Monocrystalline Silicon by Molecular Dynamics

Hong Guo

doi:10.4028/www.scientific.net/AMR.393-395.1475

Paper Titles

Study on Determination of Grease Content Inner Leather by Ultrasonic-Combining-Soxhlet Extraction Method
p.1456

Study on Jet Fuel’s Silver Strip Corrosion Property and its Analytic Technology with Sulfide Compounds
p.1462

Study on Microclimate Effect by Revegetation on Concrete Slop in Guandi Hydropower Station
p.1466

Study on Microwave-Assisted Synthesis of Ionic Liquids Based on Dialkylimidazolium
p.1471

Study on Nanometric Machining Mechanism of Monocrystalline Silicon by Molecular Dynamics
p.1475

Study on Removing the Floating Oil on the Surface of Wood Vinegar
p.1479

Study on Synthesis and Characterization of a Fluorescence Probe and its Application for Determination of Superoxide Anion Radical
p.1483

Study on the Antimicrobial Properties of ZnO Suspension against Gram-Positive and Gram-Negative Bacteria Strains
p.1488

Study on the Effect of Collagen Color Fixing Agent on Leather Dyeing Performance
p.1492

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 393-395Study on Nanometric Machining Mechanism of...

Study on Nanometric Machining Mechanism of Monocrystalline Silicon by Molecular Dynamics

Abstract:

A three-dimensional model of molecular dynamics (MD) was employed to study the nanometric cutting mechanism of monocrystalline silicon. The model included the utilization of the Morse potential function to simulate the interatomic force between the workpiece and the tool, and the Tersoff potential function between silicon atoms. Amorphous phase transformation and chip volume change are observed by analyses of the snapshots of the MD simulation of the nanometric cutting process, energy and cutting forces. Dislocations and elastic recovery in the deformed region around the tool do not appear. Cutting forces initiate the amorphous phase transformation, and thrust forces play an important role in driving the further transformation development. Nanometric cutting mechanism of monocrystalline silicon is not the plastic deformation involving the generation and propagation of dislocations, but deformation via amorphous phase transformation.

You might also be interested in these eBooks

Biotechnology, Chemical and Materials Engineering

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 393-395)

Pages:

1475-1478

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.393-395.1475

Citation:

Cite this paper

Online since:

November 2011

Authors:

Hong Guo

Keywords:

Molecular Dynamic (MD), Monocrystalline Silicon, Nanometric Machining Mechanism

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] J. S. Kallman, W. G. Hoover, C. G. Hoover, et al: Physical Review B 47, 7705(1993).

Google Scholar

[2] K. E. Puttick, L. C. Whitmore, C. L. Chao, et al: Philosophical Magazine A 69, 91(1994).

Google Scholar

[3] T. Shibata, A. Ono, K. Kurihara, et al: Applied Physics Letter 65, 2553(1994).

Google Scholar

[4] L. Zhang and H. Tanaka: JSME International Journal series A 42, 546 (1999).

Google Scholar

[5] S. Shimada, H. Tanaka and N. Ikawa. Atomistic Mechanism of Surface Generation in Micromachining of Monocrystalline Silicon. Proceeding of the 1st International Euspen conference. (1999). Shaker Werlagas, Bremen.

Google Scholar

[6] R. Komanduri, N. Chandrasekaran and L. M. Raff: Philosophical Magazine 81, 1989 (2001).

Google Scholar

[7] J. Tersoff: Physical Review B 39, 5566 (1989).

Google Scholar