Simplified Three-Dimensional Thermomechanical Applications of Ball Grid Array Package

Abstract:

Three dimensional finite element models were created utilizing APDL (ANSYS Parametric Design Language) for typical multi-chip BGAP (Ball Grid Array Packages) with different sizes to analyze the structure stress and strain when loading steady thermal loads upon them. Subsequently an improved modeling approach including equivalent beam and critical solder ball joint for simplification was studied and introduced. The Darveaux method based on plastic deformation energy accumulation for predicting fatigue life of solder ball joint under thermal cyclic loading was applied to the improved model for calculation, and effects of main design parameters upon fatigue life were studied accordingly. The numerical results reflected the stress distribution and varying traits of the package, compare of results between improved model and detailed model indicates that the simplified modeling method is quite effective and available for different types of analysis. Methods and results of this paper are of certain reference value for the design and optimization for similar kind of packages.

• Periodical: Advanced Materials Research (Volumes 403-408)
• Pages: 256-265
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.403-408.256
• Online since: November 2011
• Authors: Jia Mao, Wei Hua Zhang
• Keywords: Ball Grid Array Package, Equivalent Finite Element Model, Finite Element Analysis (FEA), Multi-Chip Module, Parametric Modeling, Thermal Fatigue

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