The Impact Law of Plating Rate Based on Orthogonal Experimental for Electroless Ni-P-Nano SiC Composite Plating

Hong Wang

doi:10.4028/www.scientific.net/AMR.403-408.4426

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 403-408The Impact Law of Plating Rate Based on Orthogonal...

The Impact Law of Plating Rate Based on Orthogonal Experimental for Electroless Ni-P-Nano SiC Composite Plating

Abstract:

The orthogonal test method has been used to study the effects of the concentration of SiC, the speed of mixing, the temperature and the surfactants on depositing rate, and obtained the optimized technological scheme and fine Ni-P-SiC composite coating. The results showed that using citric acid-acetic acid as complexing agents can obtain high speed of depositing and homogeneous coating with SiC well-distributed. Among the technological parameters, the effects of temperature on depositing rate is biggest, and the surfactants is next. Give consideration to depositing rate and stability of the liquid, the temperature should be controlled at 82±2°C, the concentration of SiC particles and surfactants should be controlled in 4g/L and 60mg/L.

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Periodical:

Advanced Materials Research (Volumes 403-408)

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4426-4429

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.403-408.4426

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Online since:

November 2011

Authors:

Hong Wang

Keywords:

Depositing Rate, Electroless Composite Plating, Microstructure, Nanometer Sic, Speed of Mixing, Surfactant

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