Preparation of Nanostructured Superhydrophobic Copper and Aluminum Surfaces

Abstract:

Preparation of nanostructured superhydrophobic surfaces requires both an optimum roughness and low surface energy. Application of a direct voltage between two copper plates immersed in a dilute ethanolic stearic acid solution transforms the surface of the anodic copper electrode to superhydrophobic due to the formation of micro-nanofibrous low surface energy flower-like copper stearate as confirmed by scanning electron microscope (SEM). Nanostructured superhydrophobic aluminum surfaces have also been prepared by electrodeposition of copper films on aluminum surfaces followed by electrochemical modification by ethanolic stearic acid. The X-ray diffraction (XRD) analyses confirmed the formation of copper films on aluminum substrates. The electrodeposited copper films are composed of microdots of copper whose density increases with the decrease of deposition potential as observed by SEM. The deposited copper microdots on aluminum substrates were electrochemically modified to low surface energy copper stearate nanofibres to obtain superhydrophobicity. The copper films deposited at potentials above-0.6 V did not exhibit superhydrophobic properties. However, the copper films deposited at potential-0.6 V and below exhibited superhydrophobic properties with water drop rolling-off those surfaces.

• Periodical: Advanced Materials Research (Volume 409)
• Pages: 497-501
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.409.497
• Online since: November 2011
• Authors: Ying Huang, Dilip K. Sarkar, X.-G. Chen
• Keywords: Aluminium Surfaces, Electrochemical Modifications, One-Step Process, Scanning Electron Microscope (SEM), Superhydrophobic Copper, X-Ray Diffraction (XRD)

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