Effect of Packaging Materials and Process on the White LED Fabricated with Quantum Dots

Seong Kwon Kwak; Tae Wook Yoo; Eun Hye Kim; Bo Sung Kim; Dong Wook Lee; Sang Mun Lee; Lee Soon Park

doi:10.4028/www.scientific.net/AMR.415-417.2066

Paper Titles

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Metallographic Study of Laser Thermal Fatigue Damage on Piston
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Effect of Ce Addition on the Microstructures and Mechanical Properties of a Ni-Co-Based Superalloy
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Effect of Packaging Materials and Process on the White LED Fabricated with Quantum Dots
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Study on the Anti- Corrosion Properties of Organic and Inorganic Inhibitor by Electrochemical Treatment in Aqueous Solution
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Study on the Development of a Thin-Film Corrosion Sensor for the Monitoring of Cl Ion Penetration into Cementitious Materials
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Study on FCAW Semi-Automatic Welding Procedure of Girth Weld Joint of Line Pipes
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Experimental Research on Explosion-Protection Performance of Porous Meshy Aluminum Alloy Material
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 415-417Effect of Packaging Materials and Process on the...

Effect of Packaging Materials and Process on the White LED Fabricated with Quantum Dots

Abstract:

In order to ensure long lifetime and stable light output of LEDs the thermal performance parameters need to be designed in the LED chip package and module level, which include such items as heat sink structure and materials, interface materials and substrates. In this work we used aluminium nitride(AlN) as submount of LED chips and made chip on board(COB) type LED module. The effect of different silver(Ag) epoxy bonding materials and bonding methods on the performance of LED module were examined. The effect of addition of red quantum dot(QD) on the performance of white LED was also studied.