Study on Crack Tip Field of Shape Memory Alloy Board under Bending Load

Abstract:

This paper focuses on the thermo-mechanical behaviors of shape memory alloy (SMA) board with a crack subjected to bending load. The stress field near the crack tip of SMA board is described according to the solution of linear elastic mechanics. The phase transformation behaviors of SMA board are formulated based on Zhou’s one-dimensional phase transformation model. The phase transformation zone equation is derived to describe the phase transformation zone near the crack tip.

• Periodical: Advanced Materials Research (Volumes 457-458)
• Pages: 409-412
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.457-458.409
• Online since: January 2012
• Authors: Bo Zhou, Tai Yue Yin, Xu Kun Li
• Keywords: Board under Deformation, Crack Tip, Shape Memory Alloy (SMA), Stress Field

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