Effect of Machining Parameters on Nano-Cutting of SiC Ceramics

Abstract:

SiC ceramics is very promising to be widely applied due to the excellent physical and chemical properties.However, the very difficult process of SiC ceramics hinders its application. In this paper, the nano-cutting of SiC ceramics is simulated based on molecular dynamics. The influences of the tool rake and cutting depth on the cutting force, the kinetic energy and potential are analyzed. The results show that the cutting force, system kinetic energy and potential energy increase firstly,reach the maximum, and then decrease in the process; with the increase of the tool rake, the cutting force and the kinetic energy decrease; with the increase of the cutting depth, the cutting force increases, and the kinetic energy and the potential energy decreases. These results are very helpful to understanding the process mechanism of SiC ceramics and increasing its process efficiency

• Periodical: Advanced Materials Research (Volumes 472-475)
• Pages: 1069-1073
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.472-475.1069
• Online since: February 2012
• Authors: Ke Zhang, Guo Zhi Liu, Hai Yan Gao, Hong Sun, Yu Lan Tang, Yu Lan Tang, Yu Hou Wu
• Keywords: Cutting Force, Energy, Molecular Dynamic (MD), SiC Ceramic, Tersoff

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