Numerical Simulation on the Temperature Distribution in Resistance Microwelding of Insulated Cu Wire

Bing Hua Mo; Xian Feng Zhang; Jia Qing Wu; Zhong Ning Guo

doi:10.4028/www.scientific.net/AMR.472-475.1143

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 472-475Numerical Simulation on the Temperature...

Numerical Simulation on the Temperature Distribution in Resistance Microwelding of Insulated Cu Wire

Abstract:

This paper develops a model to simulate wire-to-sheet lapped resistance microwelding (RMW) process. The model employs a coupled thermal–electrical–mechanical analysis and accounts for temperature-dependent thermophysical properties of materials, contact resistance and the Peltier effect. Results show the interface temperature between the molybdenum electrode and copper wire is higher than the faying surface. The predicted thermal distributes agree well with the experimental data. The proposed model can be applied to predict the effects of the welding parameters.