Research SMT Technology Parameter Optimize Based on NiPdAu PCB

Jin Wei Yu

doi:10.4028/www.scientific.net/AMR.472-475.1240

Paper Titles

Optimization of Process Parameters using DOE, RSM, and GA in Plastic Injection Molding
p.1220

The Sustainable Development Research about Microfinance - Take the Rural Credit Cooperative of Hebei Province as an Example
p.1224

Study on Composites for Furniture with Waste Paper and Wood Particle
p.1228

Research on the Interface Bonding Conditions of Bimetallic Rolls Manufactured by Liquid-Solid Bonding Method
p.1233

Research SMT Technology Parameter Optimize Based on NiPdAu PCB
p.1240

A Novel Composition Forecasting Model Based on Choquet Integral with Respect to L-Measure and O-Density
p.1245

Study on the Dephosphorization in Basic Electrode Welding
p.1249

The Stability and Management of “Sandwich” Type Slopes in Extrusive Rock Area
p.1253

Application of Fracture Mechanics in Ocean Engineering Structures Quality Control
p.1257

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 472-475Research SMT Technology Parameter Optimize Based...

Research SMT Technology Parameter Optimize Based on NiPdAu PCB

Abstract:

In the era of lead-free solder joints, nickel palladium gold PCB for its superior reliability and economy, more and more favored by the market , because the coating is added to palladium , SMT technology parameters have to be changed , to get solder joints of high reliability , therefore, analyzed quality factors of affecting solder joint formation of SMT process , rationally designed experiment program , obtained relative experimental data , analysis of larger speciality signal noise ratios and means , obtained optimizing SMT technology parameter for new nickel palladium gold plating , according to optimize results, improving SMT technology parameter, successfully applied nickel palladium gold PCB to SMT process ,reduce cost, improve product quality, and achieved good economic benefit .