Embedded System for PCB Soldering Platform Controller Design

Mao Lin Chen; Kai Jung Chen

doi:10.4028/www.scientific.net/AMR.472-475.2471

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 472-475Embedded System for PCB Soldering Platform...

Embedded System for PCB Soldering Platform Controller Design

Abstract:

We make use of embedded BASIC Stamp 2 (BS2) microchip controller to design with Hopfield neural network (HNN) as the foundation of sample training, which applies for a soldering platform of mechanical vision and accomplishes PCB soldering positioning technology. The system is verified by Matlab and Simulink to set up the simulation of PCB image soldering positioning. The experiment is proved to improve the traditional low efficiency of PCB soldering technology, to achieve the feasibility of PCB image positioning and to promote the soldering quality.

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Advanced Manufacturing Technology, ICMSE 2012

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Periodical:

Advanced Materials Research (Volumes 472-475)

Pages:

2471-2475

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.472-475.2471

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Online since:

February 2012

Authors:

Mao Lin Chen, Kai Jung Chen

Keywords:

Embedded Microchip, Hopfield Neural Network (HNN), Mechanical Vision, PCB Image Positioning

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