The Research about EDTA Plating Solutions of Non-Cyanide Copper Plating

Ren Chun Fu; Zhong Cheng Guo; Wei Min Zhou; Zhen Chen

doi:10.4028/www.scientific.net/AMR.472-475.2795

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 472-475The Research about EDTA Plating Solutions of...

The Research about EDTA Plating Solutions of Non-Cyanide Copper Plating

Abstract:

Six formulae of plating solution were studyed in the experiment. The first formula was cyanide plating solutions. The others formulae based on the EDTA as primary complexing agent, C6H5O7K3•H2O and KNaC4H4O6•4H2O as auxiliary complexing agent. Bath quality of the six formulae were examined and Compared. The results show that the EDTA system improve the ability of throwing power, covering power, current efficiency and reduce the bath voltage. In some ways, the performance of EDTA system were better than cyanide plating solutions, such as the deep plating ability, dispersing power, cathodic current efficiency.