Study on Ni-P-Nanometer Diamond Composite Electroless Plating for 2A12 Aluminum Alloy

Abstract:

On the basis of electroless Ni-P plating, the technique of electroless Ni-P-nanometer diamond composite plating for 2A12 aluminum alloy was studied. The table of L₉ (3⁴) of orthogonal design was adopted in the experiment. The optimal formulation of plating bath for 2A12 aluminum alloy was determined. The effect of bath composition on deposition rate and adhesion strength was studied. The results show that the order of marked factors on deposition rate from large to small is nanometer diamond, sodium acetate, nickel sulfate hexahydrate and sodium hypophosphite in turn, while for adhesion strength is nanometer diamond, sodium acetate, sodium hypophosphite and nickel sulfate hexahydrate. The optimal plating formulation are consisted of nanometer diamond (2g/L), NiSO4•6H2O (30g/L), NaH2PO2•H2O (30g/L) and CH3COONa (15g/L), which is operated at 80~85°C, pH (4.5). The microstructure of coating plated with optimal process is cellular structure, which is homogeneous, compact and good brightness, and its deposition rate is 17.0μm/h.

• Periodical: Advanced Materials Research (Volumes 472-475)
• Pages: 2926-2929
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.472-475.2926
• Online since: February 2012
• Authors: Gang Yi Cai, Bing Yi Yan, Xue Feng Shi
• Keywords: Aluminium Alloy, Composite Electroless Plating, Nanometer Diamond, Ni-P, Orthogonal Design

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