Effect Mechanism of Elliptic Vibration Assistance on the Cutting of Brittle Materials

Abstract:

A theoretical analysis for the effect mechanism of elliptic vibration assistance on the cutting of brittle materials is presented in this paper. The crack propagation in the chip formation zone in cutting of brittle materials is examined based on an analysis of the geometry and forces in the cutting region. The cutting model shows that the actual undeformed chip thickness is much decreased with elliptic vibration assistance, and the instantaneous rake angle of the cutting tool edge is also in a larger negative value than those in conventional cutting. These two conditions can ensure the compressive stress is much larger than the shear stress during the cutting process. Then the stress intensify factor is suppressed effectively and the shielding effect on the growth of pre-existing flaws is strengthened in the chip formation zone. The removal of brittle material tends to be in ductile mode without fracture. The characteristic examination of cutting force shows that the ratio of thrust force to cutting force with elliptic vibration is increased compared to that of conventional cutting. This can validate that the larger compressive stress can be generated in the chip formation zone with elliptic vibration assistance. The transition depth to brittle machining of silicon carbide with/without elliptic vibration assistance further supports the presented theory.

• Periodical: Advanced Materials Research (Volumes 472-475)
• Pages: 499-504
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.472-475.499
• Online since: February 2012
• Authors: Yun Feng Peng, Tao Jiang, Yin Biao Guo, Zhen Zhong Wang, Yong Bo Wu
• Keywords: Brittle Material, Ductile Mode, Effect Mechanism, Elliptic Vibration Assistance

References

[1] D. E. Brehl, T. A. Dow: Precision Engineering Vol. 32 (2008), pp.153-172.

[2] E. Shamoto, T. Moriwaki: CIRP Annual, Vol. 48 (1999), pp.441-444.

[3] H. Weber, J. Herberger, R. Pilz: CIRP Annual Vol. 33 (1984), pp.85-87.

[4] M. Xiao, K. Sato, S. Karube, T. Soutome: International Journal of Machine Tools and Manufature, Vol. 43 (2003), pp.1375-1382.

[5] M. Zhou, Y. Eow, B. Ngoi, E. Lim: Materials and Manufacturing Processes, Vol. 18 (2003), pp.825-834.

[6] D. E. Brehl, T. A. Dow, K. Garrard, A. Sohn: Proc ASPE, Vol. 39 (2006), pp.511-514.

[7] D. E. Brehl, T. A. Dow editors: Proc ASPE, Vol. 40: 2007.

[8] M. A. Cerniway: Elliptical diamond milling: kinematics, force, and tool wear. M.S. thesis. North Carolina State University, (2001).

[9] E. Shamoto, N. Suzuki, E. Tsuchiya, Y. Hori, H. Inagaki, K. Yoshino: CIRP Annual, Vol. 54 (2005), pp.321-324.

DOI: 10.1016/s0007-8506(07)60113-9

[10] N. Suzuki, S. Masuda, M. Haritani, E. Shamato: In: Proceedings: Int. Symposium on Micro-NanoMechatronics and Human Science, (2004), pp.133-138.

[11] N. Negishi: Elliptical vibration-assisted machining with single crystal diamond tools. M.S. thesis. North Carolina State University (2003).

[12] J. H. Ahn, H. S. Lim, S. M. Son: Proc ASPE, Vol. 20 (1999), pp.150-153.

[13] T. Moriwaki, E. Shamoto: CIRP Ann, Vol. 44 (1995), pp.31-34.

[14] K. Liu, X. Li and S. Liang: International Journal of Advanced Manufacturing Technology, Vol. 33 (2007), pp.875-884.

[15] K. Liu, X. Li: Trans NAMRI/SME, Vol. XXIX (2001), pp.251-258.

[16] D. Broek: Elementary engineering fracture mechanics, Martinus Nijihoff Publishers. The Hague. (1984).

[17] J. Patten, W. Gao, K. Yasuto: Transactions of the ASME: Journal of Manufacturing Science and Engineering, Vol. 127 (2005), pp.522-532.

[18] J. Ahn, H. Lim and S. Son: International Journal of the Korean Society of Precision Engineering, Vol. 2(3) (2001), pp.41-46.