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Morphologies and Properties of Epoxy Resin–Low Molecular Weight Polyamide Curing System Modified with Expanded Graphite

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Abstract:

Abstract. Expanded graphite (EG) was prepared through high-temperature oxidation using natural flake graphite (NG). The curing system of epoxy resin (EP)-low molecular weight polyamide (LPA) was modified with expanded graphite. The mechanical property, thermal stability and electrical property, micro-structure and micro-morphology characterization of the curing system EP-LPA/EG were studied. The results showed that impact strength and thermal stability of the EP-LPA/EG increased with the addition of expandable graphite. Expandable graphite lowers the electrical resistivity of the complex curing system. SEM analysis indicates that expanded graphite dispersed homogeneously in the EP-LPA/EG curing system. The existence of EG made the curing system taking on loosen multiporous structure, and increased the interface effect of the EP-LPA/EG systems.

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Periodical:

Advanced Materials Research (Volumes 476-478)

Pages:

2300-2303

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.476-478.2300

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Online since:

February 2012

Authors:

Gui Xiang Hou, Shao Wei Yao, Xiao Ming Sang, Shou Wu Yu

Keywords:

Curing System, Epoxy Resin (ER), Expanded Graphite, Low Molecular Weight Polyamide

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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