Thermal and Dielectric Properties of Inorganic-Organic Nanocomposites Involving Epoxy Resin and Polyhedral Oligomeric Silsesquioxanes

Abstract:

In this paper, a type of nanoporous polyhedral oligomeric silisesquioxanes (POSS) containing eight functional groups have been synthesized and mixed with diglycidyl ether of bisphenol A (DGEBA) to form epoxy resin networks with nanostructures. The cured octa(aminophenyl) silsesquioxane (1c-POSS) and DGEBA system inherently possesses higher thermal stability and higher char yield than the control epoxy resins. Furthermore, the dielectric constant of the 1c-POSS/DGEBA material (4.36) is substantially lower than that of the neat epoxy resins (4.64) as a consequence the presence of nanoporous POSS cubes in the epoxy matrix.

• Periodical: Advanced Materials Research (Volumes 476-478)
• Pages: 665-669
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.476-478.665
• Online since: February 2012
• Authors: Li Yang, Miao Yin, Xiu Yun Li, Han Bing Ma
• Keywords: Epoxy Resin (ER), Nanocomposite, POSS, Thermal and Dielectric Properties

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